OCZ DDR2 PC2-6400 / 800MHz / Titanium XTC / EPP-Ready Edition / Dual Channel

The new OCZ PC2-6400 Titanium Series is equipped with Enhanced Performance Profiles (EPP) to optimize the modules' performance on current nForce® 590 SLI-based motherboards and impending NVIDIA platforms. OCZ exclusively engineered select high-performance modules with advanced SPD (Serial Presence Detect) settings to allow compatible motherboards to recognize and utilize the added information, ultimately increasing the performance potential of the entire platform.

The PC2-6400 Titanium EPP-Ready series delivers enthusiasts an alternative way of achieving high performance results without the need for substantial bus speeds and provides a true "Plug and Play" overclocking feature that eliminates the need for manual configuration and makes memory optimizations a household item for beginners and gamers.

OCZ PC2-6400 Titanium memory modules are programmed to boot at 800MHz DDR2 with supremely fast timings of 4-4-4 1T on on AM2 nForce 590 SLI platforms. Only motherboards equipped with the custom-designed BIOS, such as those designed for NVIDIA nForce 590 SLI MCPs, can detect the optimized SPD profiles and ensure the memory functions under the best possible conditions. Because the PC2-6400 Titanium modules are capable of accepting one command per clock cycle (1T), bus contention issues are solved and memory performance is increased by a considerable amount.

Each DDR2-800 Titanium modules comes equipped with integrated titanium-mirrored XTC heatspreaders for the most efficient heat dissipation, toll-free technical support, the exclusive EVP (Extended Voltage Protection) coverage, and an industry leading Lifetime Warranty.


* Under standard voltage operating conditions, these modules are rated at CAS latency 5. On nForce chipset-based motherboards with support for Enhanced Performance Profile (EPP) memory, the EPP profile specifies 2.1V supply voltage at which CAS latency 4 operation at 800MHz can be achieved without problems.

**XTC (Xtreme Thermal Convection) heatspreaders optimize the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained.

***OCZ EVP (Extended Voltage Protection) is a feature that allows performance enthusiasts to use a VDIMM of 2.25V without invalidating their OCZ Lifetime Warranty.