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OCZ / Products / Memory / OCZ DDR2 PC2-6400 Gold 16GB Quad Kit
OCZ DDR2 PC2-6400 Gold 16GB Quad Kit


800MHz DDR2       
CL 5-5-5-18
(CAS-TRCD-TRP-TRAS)       
Available in 16GB (4x4GB)Kits       
Unbuffered       
Gold Layered XTC Heatspreader*       
Lifetime Warranty       
1.8 Volts       
240 Pin DIMM

Special Features        
1.85V EVP**

Part Numbers

16GB (4x4GB) Q/C Kit PN - OCZ2G80016GQ

       

   

OCZ DDR2 PC2-6400 / 800MHz / 4x4GB Modules / Gold Edition

“P45 Special” 4GB modules are exclusively supported by Intel®’s latest chipset. Available in 16GB "quad" kits, this new line of 4GB modules supports the latest memory-hungry applications and games, while offering superior performance headroom. As an industry first, OCZ brings system memory densities to the desktop segment that were reserved previously for high-end server configurations, offering a unique range of high-density kits to suit the varying requirements and budgets of gamers, enthusiasts, and professionals.

The PC2-6400 4GB modules are ideal for enthusiasts, professionals, and DIY system-builders using 64-bit operating systems that can take advantage of high density memory configurations. As the ultimate challenge for hardcore gamers, the latest DirectX-10 games require large amounts of memory to minimize swapfile access and allow smooth game play.

The new PC2-6400 Gold series is optimized for perfect compatibility for the latest games on 64-bit operating systems. Furthermore, each OCZ Gold Series module is 100% hand-tested for quality assurance and compatibility and is backed by an industry leading OCZ Lifetime Warranty and technical support for unparalleled peace of mind.


* Currently only P45 and P43 chipsets support 8GB/16GB RAM densities. In order to boot on some motherboards this product is programmed to 667MHz; to run at 800MHz you will need to manually set the speed to 800MHz and voltage to 1.8V in your BIOS.

**XTC (Xtreme Thermal Convection) heatspreaders optimize the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained.

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