 |  |  | 1066MHz DDR2 |
| EPP 5-5-5-15
(CAS-TRCD-TRP-TRAS) |
| Available in 1GB (1024MB) modules |
| Also available in a 2GB (2x1024) dual channel kit |
| Unbuffered |
| Platinum Mirrored XTC Heatspreader* |
| Lifetime Warranty |
| 2.1 - 2.3** Volts |
| 240 Pin DIMM
Special Features
|
| NVIDIA® SLI certified |
| EPP-Ready
Part Numbers
1GB Module P/N - OCZ2N10661G |
|
| |  | | OCZ DDR2 PC2-8500 / 1066MHz / Platinum XTC / NVIDIA® SLI-Ready Edition
New OCZ PC2-8500 Memory Modules are NVIDIA nForce SLI Certified resulting in better performance with select NVIDIA nForce motherboards
The new OCZ PC2-8500 Platinum Series is equipped with NVIDIA Enhanced Performance Profiles (EPP) to optimize the modules- performance on nForce® SLI-based motherboards. OCZ exclusively engineered select high-performance modules with advanced SPD (Serial Presence Detect) settings to allow compatible motherboards to recognize and utilize the added information, ultimately increasing the performance potential of the entire platform.
OCZ SLI-Ready memory modules are programmed to boot at 1066MHz DDR2 with supremely fast timings of 5-5-5. Only motherboards equipped with the custom-designed BIOS, such as those designed for NVIDIA nForce SLI MCPs, can detect the optimized SPD profiles and ensure the memory functions under the best possible conditions. The exclusive OCZ SPD specifications take out the guesswork and provide enthusiasts and gamers with significant overclocked performance with no manual adjustment or compatibility issues.
Each OCZ SLI-Ready module comes equipped with integrated platinum-mirrored XTC heatspreaders for the most efficient heat dissipation, toll-free technical support, the exclusive EVP (Extended Voltage Protection) coverage, and an industry leading Lifetime Warranty.
With the fusion of the sophisticated EPP memory specification and cutting-edge, high-speed OCZ DDR2 architecture, the PC2-8500 Platinum edition is the ultimate breakthrough for advanced SLI platform performance.
* XTC (Xtreme Thermal Convection) heatspreaders optimize the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained.
**Do not exceed 2.1V specification if listed on the module label
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