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OCZ / Products / Memory / OCZ DDR3 PC3-14400 Intel® XMP Ready Titanium Edition
OCZ DDR3 PC3-14400 Intel® XMP Ready Titanium Edition


1800MHz DDR3       
CL 8-8-8
(CAS-TRCD-TRP)       
XMP Profile 1: 1800MHz 8-8-8*       
XMP Profile 2: 1800MHz 7-7-7       
Available in 1GB modules and 2GB kits       
Unbuffered       
Titanium Z3 XTC Heatspreader**       
Lifetime Warranty       
2.05 Volts       
240 Pin DIMM       
Optimized for the Intel® X48 chipset

Part Numbers

1GB (1024MB) Module PN - OCZ3T1800XM1G

2GB (2 X 1024MB) Module PN - OCZ3T1800XM2GK

       

   

OCZ DDR3 PC3-14400 / 1800MHz / Titanium Edition / Intel Extreme Series

1800MHz Intel® Extreme Memory modules are a performance solution that implement a specification predefined and specially tailored for the Intel X48 chipset. These top-speed modules are the ideal solution for enthusiasts looking for the extra performance gains optimized memory offers their system.

Designed to significantly increase performance levels of the entire platform, these modules feature Intel Extreme Memory Profiles (XMP), an exclusive set of SPD (Serial Presence Detect) settings that act as an integrated “plug and play” overclocking tool. Configured to Intel’s defined specification, these XMP-Ready memory kits will be configured to run CL8 latencies at 1800 MHz. Furthermore, each OCZ XMP module also features CL7 latencies on a second profile that is qualified by OCZ for the extreme enthusiast seeking tighter timings.

Each OCZ DDR3 module is backed by the industry-leading OCZ Lifetime Warranty and technical support for unparalleled peace of mind. Combining the blazing speeds and incredible bandwidth of DDR3 with the power of Intel’s latest chipset, overclockers and gamers will experience the unleashed system performance this memory kit offers.

Not up to speed on DDR3 technology? Please enjoy these DDR3 FAQs.


* Intel qualified specification


**XTC (Xtreme Thermal Convection) heatspreaders optimize the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained.

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