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OCZ / Products / Memory / OCZ DDR3 PC3-15000 Flex EX Low Voltage Triple Channel
OCZ DDR3 PC3-15000 Flex EX Low Voltage Triple Channel


1866MHz DDR3       
CL 7-7-7-28       
Available in 6GB (3x2048) Triple Channel Kits       
Unbuffered       
OCZ Lifetime Warranty       
1.65 Volts       
240 Pin DIMM       
2 x 1/8" ID (inner diameter) barbs

Special Features       
Flex EX XLC Heatsink*

Part Numbers

6GB (3x2048) T/C Kit PN - OCZ3FXE1866LV6GK       

   

OCZ DDR3 PC3-15000 / 1866 MHz / Flex EX XLC / 6GB Low Voltage / Triple Channel

The Flex EX memory series features breakneck speeds demanded by enthusiasts in an updated compact form factor to maximize memory configurations on your motherboard. These premium high-density modules operate at incredibly fast DDR3 speeds to run the latest memory-intensive games and applications, and offer enthusiasts the thermal management necessary for the stability and performance on high-end gaming and overclocking systems.

The OCZ Flex EX heat management solution enables high-frequency memory to operate within an optimal balance of extreme speeds and low latencies without the high temperatures that inhibit or damage the module. Each Flex EX memory module features this breakthrough thermal management technology from OCZ, combining an effective new heatspreader design with integrated liquid injection system and dedicated channels directly over the module’s Ics. The new improved thinner form factor of the Flex EX heatsink allows multiple kits to be installed on most motherboards to maximize your RAM capabilities. This latest series was engineered with a unique “flexible” design to give enthusiasts the option to run the modules passively or water cooled via the array of aluminum fins, and the concurrent use of both options promotes maximum heat dissipation.

Developed for enthusiasts and early-adopters, the low voltage OCZ Triple Channel solutions are the choice counterparts for leading-edge performance that won’t inhibit the functionality of Core i7 CPUs. In addition, modules are tested in matched triplets ensuring superior compatibility.

click image to enlarge


Not up to speed on triple channel memory? Please check out our Triple Channel Memory FAQs.


* The new OCZ Flex EX XLC (Xtreme Liquid Convention) heatsink delivers superior heat dissipation via the integrated pure aluminum heatsink and dedicated double liquid cooling channels directly over the module's ICs. The Flex EX module was engineered with this unique "flexible" design to give enthusiasts the unparalleled option to run the modules passively or water cooled. The concurrent use of both technologies promotes maximum heat dissipation and pushes thermal management of memory modules one step further to keep up with the ever-increasing frequency demands. Flex EX modules seamlessly co-migrate with any system upgrade to liquid cooling.

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