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OCZ / Products / Memory / OCZ DDR3 PC3-8500 Special Ops Edition
OCZ DDR3 PC3-8500 Special Ops Edition


1066MHz DDR3       
CL 7-7-7-24
(CAS-TRCD-TRP-TRAS)       
Available in 1GB and 2GB modules       
Available in 2GB and 4GB Dual Channel Kits       
Unbuffered       
Camo Motif XTC Heatspreader*       
Lifetime Warranty       
1.6 Volts       
240 Pin DIMM

Special Features
       
1.75V EVP**

Part Numbers

1GB Module PN - OCZ3SOE10661G

2GB Module PN - OCZ3SOE10662G

2GB (2x1024MB) D/C Kit PN – OCZ3SOE10662GK

4GB (2x2048MB) D/C Kit PN - OCZ3SOE10664GK       

   

OCZ DDR3 PC3-8500 / 1066MHz / Special Ops Series / Limited Edition / 1GB and 2GB Modules

Prepare for the ultimate fragfest with these ultra-stealthy Special Ops Edition memory modules for your DDR3 gaming system! Featuring the high densities and stability gamers demand, these DDR3 kits are ideal for users advancing to the next generation of memory platforms, offering the speeds, density, and reliability required for the latest DirectX 10 PC titles. Featuring a unique camouflage motif heatspreader design, the DDR3 Special Ops Edition Series was designed for gaming systems in need of a reliable upgrade as well as some extra style.

The PC3-8500 SOE will be available in 1GB and 2GB modules, and 2GB and 4GB dual channel kits for the high densities demanded by graphic-intensive games, operating systems, and applications. With today’s games requiring a minimum of 2GB of system memory, the Special Ops Edition is the ideal solution for gamers who need high density options in addition to superior reliability and bandwidth management without the hefty price point. These modules offer the stability and speed to give gamers the performance edge with a highly reliable, future-proof system that takes advantage of all high-speed DDR3 has to offer.

100% Hand tested for quality and the unbeatable lifetime warranty will contribute to your peace of mind during even the most intensive gameplay!


* XTC (Xtreme Thermal Convection) heatspreaders optimize the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained.


**OCZ EVP (Extended Voltage Protection) is a feature that allows performance enthusiasts to use a VDIMM of 1.75V without invalidating their OCZ Lifetime Warranty.

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