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OCZ / Products / Memory / OCZ EL DDR PC-3200 1024MB Platinum XTC
OCZ EL DDR PC-3200 1024MB Platinum XTC


400MHz DDR       
CL 2-3-2-5
(CAS-TRCD-TRP-TRAS)       
Available in 1GB modules       
Also available in 2GB Dual Channel Optimized Kit       
Unbuffered       
Mirrored Platinum XTC Heatspreader*       
Lifetime Warranty       
2.8 Volts       
184 Pin DIMM

Special Features
       
Enhanced Latency Technology       
ULN2**       
3.0V EVP***

Part Numbers

1GB Module PN ? OCZP4001G       

   

OCZ EL DDR PC-3200 / 400MHz / 1GB Module / Platinum XTC Edition

The new OCZ PC-3200 1GB Platinum Edition was developed for the unique needs of gamers and enthusiasts. The PC-3200 Platinum XTC is the ultimate memory solution for contemporary graphic-intensive PC titles and provides unsurpassed reliability and performance to unleash every graphic possibility.

The new OCZ EL PC-3200 1024MB Platinum Edition utilizes the latest OCZ heatspreader design. XTC (Xtreme Thermal Convection) Heatspreaders allow increased ventilation and heat dissipation due to an innovative honeycomb design providing more direct access to the actual memory ICs.

As part of the award winning OCZ Platinum series, the PC-3200 1024MB XTC edition is built with leading edge technology designed and qualified with special selection of premium components to maximize performance when playing even the most demanding graphics intensive games. At DDR400, these 1GB modules turn out heart-pounding 2-3-2 timings with flawless performance and stability.

OCZ PC-3200 products are 100% hand-tested to ensure compliance with stringent quality standards. In addition, each member of the OCZ Platinum XTC PC-3200 family is backed by an industry-leading lifetime warranty, toll-free technical support and the exclusive EVP (Extended Voltage Protection) coverage.

With its ultra-fast performance, high quality and reliability, the OCZ PC-3200 1024MB Platinum XTC edition is a perfect memory upgrade for memory-hungry enthusiast and gaming rigs.


* XTC (Xtreme Thermal Convection) heatspreaders optimize the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained.

**OCZ EVP (Extended Voltage Protection) is a feature that allows performance enthusiasts to use a VDIMM of 3.0V without invalidating their OCZ Lifetime Warranty.

***ULN (Ultra Low Noise) technology uses various printed circuit board (PCB) techniques to reduce the amount of electrical noise that is present in all high-speed ICs. This results in faster and more stable memory.


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