OCZ DDR3 PC3-16000 / 2000MHz / NVIDIA® SLI™-Ready Edition / EPP 2.0 Ready

The blistering fast PC3-16000 DDR3 modules are NVIDIA SLI-certified to run at an extreme 2GHz on the next generation NVIDIA nForce 790i Ultra SLI motherboards. Designed to offer enthusiasts the rock-solid stability and speed they’ve been demanding, the OCZ PC3-16000 SLI-Ready series makes use of the unbeatable overclocking capabilities of the nForce 790i Ultra SLI platform and takes DDR3 to new heights.

Each OCZ PC3-16000 SLI-Ready memory module features EPP 2.0, the next generation of the widely adopted EPP 1.0 SPD (Serial Presence Detect) specification. Delivering enhanced system performance, OCZ EPP 2.0 modules are programmed to boot at 2000MHz DDR3 with aggressive timings of 9-9-9. Only motherboards equipped with the custom-designed NVIDIA nForce 790i Ultra BIOS can detect the optimized SPD profiles and ensure the memory functions under the best possible conditions. The exclusive OCZ SPD profiles take out the guesswork and provide enthusiasts and gamers with significant overclocked performance with no manual adjustment or compatibility issues.

As part of the NVIDIA SLI technology ecosystem, these modules undergo a rigorous series of tests by NVIDIA and are certified to provide enthusiasts and gamers the performance, compatibility, and stability they seek when building an SLI gaming system. Tailored specifically for the NVIDIA gamer, each OCZ DDR3 certified memory kit features the exclusive black SLI-Ready XTC (Xtreme Thermal Convection) heatspreader for the most efficient heat dissipation, and a look that stands out like its performance.


* Qualified on XFX and EVGA 790i motherboards

**NVIDIA nForce 790i platforms only

***XTC (Xtreme Thermal Convection) heatspreaders optimize the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained.