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A
AOD
(AMD Overdrive) The AMD "OverDrive™ feature can unleash the remote stored memory profiles directly from AMD when used in conjunction with qualified motherboards. AOD detects your OCZ Black Edition RAM with certified motherboards and AMD Black Edition Phenom CPUs, and data is sent to a remote server to download the correct profiles without the need to manually overclock your settings.
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B
BGA Ramsink
OCZ BGA (Ball Grid Array) Ramsinks are designed to aid in heat dissipation of BGA memory, resulting in cooler, more stable video cards.
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C
ConnectAll™
The all-in-one connectivity systems offered by the PowerStream power supply family. (ATX, BTX, Serial ATA, P4 and EPS12V).
Copper Mirrored Heatspreaders
Unlike the aluminum heatspreaders used by competing memory manufacturers, OCZ offers copper heatspreaders for all modules in the Titanium, Platinum, Gold, and Premier series. Use of high-quality copper heatspreaders results in more effective heat dissipation than aluminum heatspreaders, prolonging the life of the modules.
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D
Dual Channel Optimized
Dual channel optimized refers to qualified kits of two modules that work efficiently in dual channel mode. Modules are tested together on many different motherboards to ensure that they function properly together and meet specification. Only when two modules pass OCZ's validation do they become packaged together as a kit of Dual Channel Optimized memory.
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E
EB
(Enhanced Bandwidth) Technology that provides intelligent bandwidth management by offering the lowest possible page access times while reducing the strain on the DRAM I/O logic by allowing relaxed CAS latencies that are hidden behind burst outputs of data. The result is unsurpassed effective data bandwidth to allow maximizing system performance without compromising stability.
EL
(enhanced latency) Enhanced Latency memory modules are specifically designed to run at lower latencies than normally possible on most standard memory modules
EPP / EPP2
(Enhanced Performance Profiles) A feature on OCZ NVIDIA® SLI™-Ready DDR2 or DDR3 Memory modules that allows users to "plug and play" their RAM at overclocked specifications on qualified NVIDIA chipsets without the need to manually set up the RAM in their BIOS. Only motherboards equipped with the custom-designed nForce™ BIOS can detect the optimized SPD profiles and ensure the memory functions under the best possible conditions.
EVP
(Extended Voltage Protection) A novel OCZ voltage protection feature that allows modules to handle higher voltages. OCZ EVP protected modules can tolerate VDIMM additional voltages past their stock specifications for additional overclocking headroom. All EVP protected modules are covered under OCZ's Lifetime Warranty if overvolted within EVP tolerances.
EZMod
EZMod technology was used to describe OCZ's user-friendly modular cable management for select PSUs. This system allows you to truly customize you power system to utilize only the cables you require, resulting in optimal airflow and the coolest possible environment within your case, eliminating the need for excess wires.
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F
Firmware
Programming that is written to your electronic device, which is used to control its various functions and overall performance features. Firmware can be upgraded in real-time to unlock various new features for increasing the performance of your device's functionality or fixing previous errors. OCZ offers firmware updates for certain flash storage products (including SSD and USB drives), which can be completed by the end-user following straightforward upgrading instructions via a downloadable file. OCZ firmware updates are available here.
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H
HyperSpeed
HyperSpeed Technology denotes specific IC's built and selected for their ability to run at the highest possible frequency. HyperSpeed enabled modules contain firmware and are built on a printed circuit board (PCB) that is optimized for the highest possible frequency. Due to these optimizations, the module may not be able to be run at lower timings than those specified for that particular product.
HPC
(Heat Pipe Conduit) OCZ's premium Reaper memory modules feature special Heat-pipe conduit heatspreaders to maximize passive cooling potential of high-frequency memory modules. As heat rises into the thermo-conductive copper heat pipe conduit, it is dissipated through the strategically-placed compact aluminum fin array. The addition of the extended fin array nearly doubles the total surface area available for heat dissipation while the heat pipes warrant near isothermicity throughout the entire design. The result is a doubling in effective heat dissipation at equal delta t or, in real systems, a significantly lower operating temperature of the memory modules.
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L
LV
(Low Voltage) OCZ memory that meets special low-voltage requirements for next generation CPUs and chipsets. These modules operate at full specification at 1.65 volts and below, and won't damage sensitive processors.
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P
80 Plus® (80+) Certified
80+ Certified power supplies meet the requirements for maintaining 80% efficiency at typical load. Three additional certifications including Gold, Silver, and Bronze are granted for power supplies that meet over the typical 80% efficiency ratings.
PowerClean™
A patent-pending feature of the OCZ DDR Booster diagnostic device that allows users to supply cleaner power to their memory modules, resulting in more stable memory.
PowerFlex™
OCZ PowerStream™ Power Supply Family feature designed to allow you to adjust to output voltage manually. The three screw trimmers and corresponding LED indicators allow the user to fine-tune the 12V, 5V and 3.3V rails when desired.
PowerShield™
A feature of the OCZ Enhanced VGA and HDD Power Lead that improves current ripple and reduces RF interference when plugged into high-end VGA cards and hard disk drives. The same PowerShield technology is utilized in the OCZ PowerStream™ Power Supplies.
PowerSwap
All OCZ Power Supply Families feature an exclusive warranty that allows you to "swap out" a defective power supply, without waiting for us to repair your broken unit. This eliminates the hassle of return-for-repair loops that other companies put you through, saving you time and ensuring you will receive a 100% hand tested, fully functioning unit as a replacement. Your defective power supply can be returned for replacement at any time within the specified warranty period. All replacements are guaranteed to operate without issue and to full specification.
PowerWhisper™
Select OCZ Power Supplies feature to maintain the lowest possible noise level with the highest possible performance. When the Power Supply is operating at <60% of the power load the fan will run at 20dBA(1500rpm), its lowest speed and noise level. Once the power starts to load about 60%, the fan will gradually speed up to 30dBA(3000rpm).
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T
Triple Channel Optimized
Triple channel refers to qualified kits of three modules that work efficiently in triple channel mode. Modules are tested together on many different motherboards to ensure that they function properly together and meet specification. Only when three modules pass OCZ's validation do they become packaged together as a kit of Triple Channel Optimized memory. Currently Triple Channel mode is only supported on Intel's Nehalem platform.
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U
ULN2
(ultra low noise) a technology that uses various printed circuit board (PCB) techniques to reduce the amount of electrical noise that is present in all high-speed ICs. This results in faster and more stable memory.
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V
VX
(voltage eXtreme) Voltage eXtreme technology operates above standard memory voltage to increase speed and stability to ultimately allow the memory to thrive under high voltage. Memory performance increases with voltage, but unfortunately with many traditional modules this can significantly reduce stability and increase the potential for module damage. Unlike typical memory, VX DDR performs best at an above average voltage, and better and better as voltage is increased, all without any adverse affects to stability.
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X
XLC
(Xtreme Liquid Convection) The exclusive OCZ heat management solution combines an effective heatspreader design with integrated liquid injection system and dedicated channels directly over the module's ICs. This latest series was engineered with a unique "flexible" design to give enthusiasts the option to run the modules passively or water cooled via the array of aluminum fins, and the concurrent use of both options promotes maximum heat dissipation.
XTC
(Xtreme Thermal Convection) heatspreaders optimize the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained.
XMP
(Xtreme Memory Profiles) A proprietary extension of SPD (Serial Presence Detect) settings that act as an integrated "plug and play" overclocking tool on select Intel® chipsets. XMP allows the user to plug and play their high performance RAM to specification on qualified motherboards (X38 / X48 / X58-based platforms). Each XMP kit features a second profile in addition to its primary SPD to enable the modules to run at an even more aggressive balance of speed and timings.
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Z
ZB-DDR
Zero-Buffer™ technology is aimed at lowering the cost of server and workstation memory solutions by reducing the need for costly ECC and registered chips. Using discreet zero-delay clock buffers, ZB-DDR technology combines the robustness of server class memory with the low latency of unbuffered modules, resulting in better data integrity, lower noise, and lower susceptibility to interference over a wider frequency spectrum while still remaining fully compatible with all current motherboards. Inphi Corporation played an important part in developing the IC Clock Buffer essential to OCZ's ZB-DDR™ technology.
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