OCZ Technology Glossary

A    D   E   F   H   L   P   T   X     

A

AOD

(AMD Overdrive) The AMD "OverDrive™ feature can unleash the remote stored memory profiles directly from AMD when used in conjunction with qualified motherboards. AOD detects your OCZ Black Edition RAM with certified motherboards and AMD Black Edition Phenom CPUs, and data is sent to a remote server to download the correct profiles without the need to manually overclock your settings.

D

Dual Channel Optimized

Dual channel optimized refers to qualified kits of two modules that work efficiently in dual channel mode. Modules are tested together on many different motherboards to ensure that they function properly together and meet specification. Only when two modules pass OCZ's validation do they become packaged together as a kit of Dual Channel Optimized memory.

E

EB

(Enhanced Bandwidth) Technology that provides intelligent bandwidth management by offering the lowest possible page access times while reducing the strain on the DRAM I/O logic by allowing relaxed CAS latencies that are hidden behind burst outputs of data. The result is unsurpassed effective data bandwidth to allow maximizing system performance without compromising stability.

EL

(Enhanced Latency) Enhanced Latency memory modules are specifically designed to run at lower latencies than normally possible on most standard memory modules

EPP / EPP2

(Enhanced Performance Profiles) A feature on OCZ NVIDIA® SLI-Ready DDR2 or DDR3 Memory modules that allows users to "plug and play" their RAM at overclocked specifications on qualified NVIDIA chipsets without the need to manually set up the RAM in their BIOS. Only motherboards equipped with the custom-designed nForceâ„¢ BIOS can detect the optimized SPD profiles and ensure the memory functions under the best possible conditions.

EVP

(Extended Voltage Protection) A novel OCZ voltage protection feature that allows modules to handle higher voltages. OCZ EVP protected modules can tolerate VDIMM additional voltages past their stock specifications for additional overclocking headroom. All EVP protected modules are covered under OCZ's Lifetime Warranty if overvolted within EVP tolerances.

EZMod

EZMod technology was used to describe OCZ's user-friendly modular cable management for select PSUs. This system allows you to truly customize you power system to utilize only the cables you require, resulting in optimal airflow and the coolest possible environment within your case, eliminating the need for excess wires.

F

Firmware

Programming that is written to your electronic device, which is used to control its various functions and overall performance features. Firmware can be upgraded in real-time to unlock various new features for increasing the performance of your device's functionality or fixing previous errors. OCZ offers firmware updates for certain flash storage products (including SSD and USB drives), which can be completed by the end-user following straightforward upgrading instructions via a downloadable file. OCZ firmware updates are available here.

H

HPC

(Heat Pipe Conduit) OCZ's premium Reaper memory modules feature special Heat-pipe conduit heatspreaders to maximize passive cooling potential of high-frequency memory modules. As heat rises into the thermo-conductive copper heat pipe conduit, it is dissipated through the strategically-placed compact aluminum fin array. The addition of the extended fin array nearly doubles the total surface area available for heat dissipation while the heat pipes warrant near isothermicity throughout the entire design. The result is a doubling in effective heat dissipation at equal delta t or, in real systems, a significantly lower operating temperature of the memory modules.

L

LV

(Low Voltage) OCZ memory that meets special low-voltage requirements for next generation CPUs and chipsets. These modules operate at full specification at 1.65 volts and below, and won't damage sensitive processors.

P

80 Plus® (80+) Certified

80+ Certified power supplies meet the requirements for maintaining 80% efficiency at typical load. Three additional certifications including Gold, Silver, and Bronze are granted for power supplies that meet over the typical 80% efficiency ratings.

PowerSwap

All OCZ Power Supply Families feature an exclusive warranty that allows you to "swap out" a defective power supply, without waiting for us to repair your broken unit. This eliminates the hassle of return-for-repair loops that other companies put you through, saving you time and ensuring you will receive a 100% hand tested, fully functioning unit as a replacement. Your defective power supply can be returned for replacement at any time within the specified warranty period. All replacements are guaranteed to operate without issue and to full specification.

T

Triple Channel Optimized

Triple channel refers to qualified kits of three modules that work efficiently in triple channel mode. Modules are tested together on many different motherboards to ensure that they function properly together and meet specification. Only when three modules pass OCZ's validation do they become packaged together as a kit of Triple Channel Optimized memory. Currently Triple Channel mode is only supported on Intel's Nehalem platform.

X

XLC

(Xtreme Liquid Convection) The exclusive OCZ heat management solution combines an effective heatspreader design with integrated liquid injection system and dedicated channels directly over the module's ICs. This latest series was engineered with a unique "flexible" design to give enthusiasts the option to run the modules passively or water cooled via the array of aluminum fins, and the concurrent use of both options promotes maximum heat dissipation.

XTC

(Xtreme Thermal Convection) heatspreaders optimize the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained.

XMP

(Xtreme Memory Profiles) A proprietary extension of SPD (Serial Presence Detect) settings that act as an integrated "plug and play" overclocking tool on select Intel® chipsets. XMP allows the user to plug and play their high performance RAM to specification on qualified motherboards (X38 / X48 / X58-based platforms). Each XMP kit features a second profile in addition to its primary SPD to enable the modules to run at an even more aggressive balance of speed and timings.