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B
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B
BGA Ramsink
OCZ BGA (Ball Grid Array) Ramsinks are designed to aid in heat dissipation of BGA memory, resulting in cooler, more stable video cards.
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C
ConnectAll™
The all-in-one connectivity systems offered by the PowerStream power supply family. (ATX, BTX, Serial ATA, P4 and EPS12V).
Copper Mirrored Heatspreaders
Unlike the aluminum heatspreaders used by competing memory manufacturers, OCZ offers copper heatspreaders for all modules in the Titanium, Platinum, Gold, and Premier series. Use of high-quality copper heatspreaders results in more effective heat dissipation than aluminum heatspreaders, prolonging the life of the modules.
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D
Dual Channel Optimized
Dual channel optimized means that we have qualified this kit of two modules to work well together in dual channel mode. We hand test the modules together in many different motherboards to ensure that they function properly together and are up to spec. Only when two modules pass our qualifications do they become packaged together as a kit of Dual Channel Optimized memory. This is the same as someone calling our kits a "matched pair" as the pair of modules has been validated to work together flawlessly; hence they are "matched."
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E
EB
(enhanced bandwidth) Enhanced Bandwidth Technology provides intelligent bandwidth management by offering the lowest possible page access times while reducing the strain on the DRAM I/O logic by allowing relaxed CAS latencies that are hidden behind burst outputs of data. The result is unsurpassed effective data bandwidth to allow maximizing system performance without compromising stability.
EL
(enhanced latency) Enhanced Latency memory modules are specifically designed to run at lower latencies than normally possible on most standard memory modules
EVP
(extended voltage protection) a novel OCZ voltage protection feature that allows modules to handle higher voltages. OCZ EVP protected modules can tolerate VDIMM voltages up to 3.0V ± 5%. All EVP protected modules are covered under OCZ's Lifetime Warranty if overvolted within EVP tolerances.
EZMod
Every ModStream is equipped with OCZ EZMod technology. This advanced cable management system allows you to truly customize you power system to utilize only the UV cables you require, resulting in optimal airflow and the coolest possible environment within your case.
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H
HyperSpeed
HyperSpeed Technology denotes specific IC's built and selected for their ability to run at the highest possible frequency. HyperSpeed enabled modules contain firmware and are built on a printed circuit board (PCB) that is optimized for the highest possible frequency. Due to these optimizations, the module may not be able to be run at lower timings than those specified for that particular product.
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P
PowerClean™
A patent-pending feature of the OCZ DDR Booster diagnostic device that allows users to supply cleaner power to their memory modules, resulting in more stable memory.
PowerFlex™
OCZ PowerStream™ Power Supply Family feature designed to allow you to adjust to output voltage manually. The three screw trimmers and corresponding LED indicators allow the user to fine-tune the 12V, 5V and 3.3V rails when desired.
PowerShield™
A feature of the OCZ Enhanced VGA and HDD Power Lead that improves current ripple and reduces RF interference when plugged into high-end VGA cards and hard disk drives. The same PowerShield technology is utilized in the OCZ PowerStream™ Power Supplies.
PowerSwap™
All OCZ Power Supply Families feature an exclusive warranty that allows you to "swap" a defective power supply and receive an entirely new one in its place! This elimiates the hassle of return-for-repair loops that other companies put you through, saving you time and ensuring you will receive a brand-new, fully functioning unit. Your defective power supply can be returned for replacement at any time within the specified warranty period.
PowerWhisper™
OCZ PowerStream™ Power Supply Family feature that maintains the lowest possible noise level with the highest possible performance. When the PowerStream is operating at <60% of the power load the fan will run at 20dBA(1500rpm), its lowest speed and noise level. Once the power starts to load about 60%, the fan will gradually speed up to 30dBA(3000rpm).
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U
ULN2
(ultra low noise) a technology that uses various printed circuit board (PCB) techniques to reduce the amount of electrical noise that is present in all high-speed ICs. This results in faster and more stable memory.
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V
VX
(voltage eXtreme) Voltage eXtreme technology operates above standard memory voltage to increase speed and stability to ultimately allow the memory to thrive under high voltage. Memory performance increases with voltage, but unfortunately with many traditional modules this can significantly reduce stability and increase the potential for module damage. Unlike typical memory, VX DDR performs best at an above average voltage, and better and better as voltage is increased, all without any adverse affects to stability.
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X
XTC
(Xtreme Thermal Convection) heatspreaders optimize the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained.
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Z
ZB-DDR
Zero-Buffer™ technology is aimed at lowering the cost of server and workstation memory solutions by reducing the need for costly ECC and registered chips. Using discreet zero-delay clock buffers, ZB-DDR technology combines the robustness of server class memory with the low latency of unbuffered modules, resulting in better data integrity, lower noise, and lower susceptibility to interference over a wider frequency spectrum while still remaining fully compatible with all current motherboards. Inphi Corporation played an important part in developing the IC Clock Buffer essential to OCZ's ZB-DDR™ technology.
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